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Soldering & Surface Mount Technology Cover Image for Volume 38, Issue 2
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Volume 38,
Issue 2,
5 February 2026
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Soldering & Surface Mount Technology is a unique, authoritative, international and multi-disciplinary periodical for those with a research and application interest in all branches of soldering and surface mount technologies

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Reliability study of hybrid bonded structures based on flux divergence method
Reworkable epoxy underfills with optimized curing and flow behavior for advanced electronic packaging
A comparative study of the mechanical properties of sintered submicron and micron Cu
Effects of electron irradiation and thermal cycling on electrical properties of GaN HEMT
Comparative analysis of the fatigue life of the FLASH under joint error conditions
Open access articles
July 04 2024
Effects of soldering temperature and preheating temperature on the properties of Sn–Zn solder alloys using wave soldering
Songtao Qu, Qingyu Shi et al.
April 28 2022
Thermal and mechanical analysis of low-temperature and low-pressure silver-based sintered thermal joints
Krzysztof Jakub Stojek, Jan Felba et al.
July 01 2020
Structural characterization of inkjet printed capacitor layers in various technological conditions
Milena Kiliszkiewicz, Dariusz Przybylski et al.
June 05 2020
Impact of convection on thermographic analysis of silver based thermal joints
Krzysztof Jakub Stojek, Jan Felba et al.
May 12 2020
Low-voiding solder pastes in LED assembly
Barbara Dziurdzia, Maciej Sobolewski et al.

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Editor(s):
Professor Peng He

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