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Microelectronics International Cover Image for Volume 43, Issue 1
Current Issue
Volume 43,
Issue 1,
3 March 2026
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Volume 43, Issue 2, April 2026

About the Journal

Microelectronics International comprises a multi-disciplinary study of the various technologies, processes and current practices associated with miniaturized electronic devices and advanced packages.

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Guest editorial: Advanced sensing and control techniques for safety enhancement of power electronics components and systems in renewable energy applications-Part 1
Design of reconfigurable liquid crystal holographic antenna fed by a slow-wave rectangular waveguide
Silicon photonics packaging for AI datacenters: technical challenges, reliability requirements and future directions – a critical review
Review of aluminum nitride buffer layer for high electron mobility transistor applications: growth technique and substrate choice
Analysis of stress relaxation in gate pins of press-pack IGBT devices based on multiphysics coupling
Open access articles
October 13 2022
Influence of Ag particle shape on mechanical and thermal properties of TIM joints
Marcin Myśliwiec, Ryszard Kisiel et al.
April 02 2020
Additive manufacturing revolution in ceramic microsystems
Witold Nawrot, Karol Malecha

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Editor(s):
Professor Chong Leong Gan

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